SiCw/BAS玻璃陶瓷基复合材料的显微结构与力学性能  

MICROSTRUCTURE AND MECHANICAL PROPERTIES OF SiCw/BAS GLASS-CERAMICS COMPOSITE

作　　者：杨觉明[1] 包小平[1] 李建平[1] 陈平[1] 

机构地区：[1]西安工业学院材料科学与工程系

出　　处：《兵器材料科学与工程》2001年第3期18-21,共4页Ordnance Material Science and Engineering

基　　金：陕西省自然科学基金 (98C0 6)资助

摘　　要：研究了热压SiCw/BAS复合材料的六方 -单斜晶型转变、显微结构与力学性能。结果表明 ,复合材料中SiC晶须的存在阻碍单斜钡长石晶种促进六方 -单斜晶型转变 ;SiC晶须能显著改善BAS玻璃陶瓷基体的力学性能。增韧机制主要是裂纹偏转和晶须断裂 ,增强机制主要是载荷传递。另一方面 ,SiC晶须 /基体界面存在的玻璃相不利于晶须拔出和桥接增韧效应 ,玻璃相的高温软化降低复合材料的高温强度。The transformation from hexacelsian to celsian, the microstructure and the mechanical properties of the hot-pressed SiCw/BAS composites was investigated . The results show that the transformation form hexacelsian to celsian promoted by adding celsian seeds is retarded by the presence of SiC whisker in the composite,and the mechanical properties of BAS glass ceramic matrix can be improved remarkably by the SiC whisker. The toughening mechanisms are crack deflection and whisker fracture,and the strengthening mechanism is loading-transfer. On the other hand the amorphous phase exists at the interfaces of SiCw/BAS matrix damages the fracture toughness and high temperature strength of the composite.

关 键 词：玻璃陶瓷 钡长石 复合材料 增韧补强 显微结构 SiCw/BAS 晶须 

分 类 号：TB33[一般工业技术—材料科学与工程]