SiC_p表面化学镀镍合金层的成分与形貌研究  

Study on the Composition and Morphology of Electroless Nickel Plating on SiC_p

作　　者：陈曙光[1] 丁厚福[1] 郑治祥[1] 

机构地区：[1]合肥工业大学材料科学与工程学院,安徽合肥230009

出　　处：《表面技术》2001年第4期3-5,共3页Surface Technology

基　　金：国家科技部攻关项目 ( 99-D0 5 1)

摘　　要：SiCp 因其高强度 ,高模量、耐热、耐磨等优良性能而被作为颗粒增强体制备金属基复合材料。采用优化后的SiCp 表面化学镀镍工艺 ,获得了镍合金包覆SiCp,并对镀镍合金层进行了X ray衍射成分分析以及镀覆层形貌的SEM考察。结果表明 ,镀覆层主要为部分非晶态的镍与镍磷合金以及Ni2 P的化合物夹杂 ;粒子的分散很好 。Because of its excellent properties,such as high strength, high module,heat resistance,wear resisance etc,SiC p is putted in some metal matrix composites as a reinforcing particle.In this present work,a optimized process of electroless nickel plating on SiC p was adopted,and SiC p covered with electroless nickel coating was obtained.The composition of deposited coating was analyzed with X ray diffraction,and the morphology of deposited coating was measured by scanning electron microscope(SEM).As the results show deposited coating is mainly composed of partial amorphous nickel and nickel alloys, meanwhile,the particles are fine dispersed.

关 键 词：SICP 化学镀镍 合金层 成分 形貌 前处理 

分 类 号：TQ153.12[化学工程—电化学工业]