Sn60Pb40纤料合金的具有蠕变和塑性边界的粘塑性本构方程  

Viscoplastic Constitutive Equation with Creep and Plasticity Bounds for Sn60Pb40 Solder Alloy

作　　者：王莉[1] 方洪渊[2] 钱乙余[2] 丁克俭 

机构地区：[1]中科院上海冶金研究所,200050 [2]哈尔滨工业大学,哈尔滨150001 [3]无锡群力有色金属材料厂,214000

出　　处：《应用力学学报》2001年第3期130-133,共4页Chinese Journal of Applied Mechanics

摘　　要：采用具有蠕变和塑性边界的粘塑性本构方程对Sn Pb共晶合金的基本力学行为进行了模拟和预测。结果表明 :在较宽的外部变量范围 (应变率为 1 0 -5 ～ 1 0 -2 S-1,温度为 - 55～ 1 2 5℃ )内 ,模拟结果与实验结果吻合良好。证明了该方程用于描述SnViscoplastic constitutive equation with creep and plasticity bounds was used to simulate and predict the basic mechanical behaviors of Sn60Pb40 solder alloy. Th e results showed that within a broad range of external variable with temperature varying from -55℃ to 125℃ and the strain rate from 10 -5S -1 to 10 -2S -1, the computed results were in agreement with the experim ental data. The equation provides reliable assurance for predicting the life of SMT solder joints.

关 键 词：粘塑性 本构方程 数值 锡-铝共晶合金 钎料合金 蠕变 塑性 

分 类 号：TG425[金属学及工艺—焊接]