光敏剂诱导化学镀工艺研究  

Study on Electroless Plating Induced by Photosensitizer

作　　者：陈碧玮 

机构地区：[1]航空科技集团公司第四研究院7414厂,陕西西安710025

出　　处：《表面技术》2001年第5期1-6,共6页Surface Technology

摘　　要：根据光化学催化原理 ,在酸性镀液中加入光敏剂 ,通过光照 ,实现在室温条件下的化学镀镍 磷合金。在以前所做的实验基础上 ,着重研究了光敏剂浓度、硫酸镍浓度、次亚磷酸钠浓度、pH值、入射光强度及络合剂柠檬酸三钠和乳酸浓度等一系列因素对沉积速度的影响 ,并得出一系列的规律和结论 ;利用循环伏安法和交流阻抗技术对不同镀液体系进行测试 。Light catalysis electroless plating Ni-P alloy can take place at the room temperature in the acidic solution containing the dye as photosensitizer under illumination(pH=5.2). On the base of experiments which have been done,effects of concentrations of photosensitizer,NaH 2PO 2,complexing agent and pH,intensity of direct light are studied.Then different bath systems are tested by means of cyclic voltammagram in order to certify the theory of electroless plating Ni P alloy. Finally,a mechanism of electroless plating induced by photosensitizer is put forward.

关 键 词：化学镀 镍-磷合金 光敏剂 循环伏安法 络合剂 

分 类 号：TQ153[化学工程—电化学工业] Q153.2[生物学—普通生物学]