脉冲电沉积钴镍合金及其生长形态的研究  

Studies on pulsed electrodeposition of cobalt-nickel alloy and morphology of deposits

作　　者：张芳[1] 荆天辅[1] 乔桂英[1] 陈闽子[1] 

机构地区：[1]燕山大学材料科学与化学工程学院,河北秦皇岛066004

出　　处：《电镀与涂饰》2001年第4期1-3,7,共4页Electroplating & Finishing

摘　　要：研究了钴镍合金镀液中mCO2 +/(mCO2 ++mNi2 +)对镀液中钴含量的影响。利用XJG - 0 5金相显微镜观察了镀层表面形貌及截面生长形态。结果表明 :合金镀层中的钴含量随着mCO2 +/(mCO2 ++mNi2 +)的增大而显著增大。电位较负的钴优先沉积 ,为异常共沉积。脉冲条件下所得镀层致密、均匀 ,呈胞状生长。The effect of mass ratio of cobalt ions to cobsalt and nickel ions in alloy bath on cobalt content in the obtained alloy deposit was studied. Morphology and growth of cobalt-nickel alloy deposit were analyzed by metallographic microscopy. The results show that coblt content in the obtained alloy deposit increase greatly with the increase of cobalt ions in alloy bath. Cobalt, the less noble metal deposits preferentially, cobalt-nickel electrodeposition belongs to anomalous codeposition. Under pulsed current, cobalt-nickel alloy deposits obtained are compact and uniform which appear to be cystiform in growth.

关 键 词：钴镍合金 脉冲电沉积 生长形态 镀液 镀层 电镀 

分 类 号：TQ153.2[化学工程—电化学工业]