硫酸盐还原菌生物膜下Cu-Zn合金的腐蚀研究  

A STUDY ON CORROSION BEHAVIOR UNDER THE BIOFILM OF SULFATE - REDUCING BACTERIA ON Cu - Zn ALLOY

作　　者：刘靖[1] 许立铭[1] 郑家燊[1] 

机构地区：[1]华中科技大学化学系,武汉430074

出　　处：《中国腐蚀与防护学报》2001年第6期345-351,共7页Journal of Chinese Society For Corrosion and Protection

摘　　要：从中原油田污水中分离提纯出硫酸盐还原菌(ＳＲＢ)菌株,采用ＡＰＩ ＲＰ－３８推荐使用的培养基在铜材料上形成生物膜．结果表明,随着细菌的生长,细菌的代谢产物改变了黄铜的电极电位．用电子探针(ＥＰＭＡ)、Ｘ射线衍射(ＸＲＤ)对生物膜形貌和成分进行了分析．生物膜中腐蚀产物成分主要有硫化亚铜(Ｃｕ２Ｓ)等硫化物,用交流阻抗(ＥＩＳ)技术对生物膜结构进行了分析．In this paper, the biofilm of sulfate- reducing bacteria (SRB) which plays an important role in corrosion of 70/30 Cu - Zn alloy under anaerobic condition has been studied. The API medium was used to culture the SRB in Zhongyuan oilfield. Potential/time measurement showed that the presence of SRB makes the corrosion protential more active with SRB growth metabolite. Electrochemical impedance spectroscopy (EIS) was used to analyse the electrode process of 70/30 Cu - Zn alloy with SRB biofilm. X - ray diffraction and EPMA were used to analyse the corrosion products. The results show that the variation of activity of the SRB biofilm with SRB growth can be found from the EIS in inoculated media. The crystal of sub - copper sulfide (Cu2S) exists in the SRB biofilm.

关 键 词：黄铜 腐蚀 交流阻抗 硫酸盐还原菌 

分 类 号：TG172.7[金属学及工艺—金属表面处理]