TC4/72Ag-28Cu钎焊组织及Ti-Cu化合物生长机理研究  

Microstructure of TC4/72Ag-28Cu joint and production mechanism of Ti-Cu compound at the interface

作　　者：吴铭方[1] 蒋成禹[1] 于治水[1] 梁超[1] 

机构地区：[1]华东船舶工业学院,江苏镇江212003

出　　处：《航空材料学报》2001年第3期29-32,共4页Journal of Aeronautical Materials

摘　　要：在钎焊温度 1 1 0 3K一定的条件下 ,分析了钎焊时间对 TC4 / 72 Ag-2 8Cu/ TC4钎焊接头组织及分布形态的影响。研究表明 :钎焊时间较短 ,扩散到界面的 Ti、Cu在冷却过程中通过共析转变形成了 Ti2 Cu化合物 ;钎焊时间大于某一临界值 ,由于母材中 Ti大量向钎缝中溶解及在界面 Cu相对浓度的降低 ,使钎缝中 Cu全部固溶在 Ti中 ,最终 Ti2 Cu化合物消失。在此基础上提出了临界钎焊时间的概念。The effect of brazing time on microstructre and morphology of joint TC4/72Ag Cu/TC4 at 1103 K was studied.based on the experimental results,it has been found that for short holding time,eutectoid transfomation took place between Ti and Cu concentrated at the interface and the compound Ti 2Cu was produced in the followed cooling stage,which limited the increase of tghe tensile strength of joints. With the increase of holding time,the joint growth mechanism of compound Ti 2Cu at the interface was studied from the point of thermodynamics.

关 键 词：银铝钎料 钛合金 固溶 钎焊时间 生长机理 钛铜化合物 钎焊接头组织 

分 类 号：TG146.23[一般工业技术—材料科学与工程] O614.411[金属学及工艺—金属材料]