铜与Al_2O_3陶瓷的粘接  

JOINING OF ALUMINA CERAMICS TO COPPER

作　　者：邵光杰[1] 秦秀娟[1] 景勤[1] 陈世镇[1] 

机构地区：[1]燕山大学材料化工学院,秦皇岛066004

出　　处：《复合材料学报》2001年第4期133-135,共3页Acta Materiae Compositae Sinica

基　　金：河北省自然科学基金 ( 5 992 37)

摘　　要：用自制的装置研究了高温下铜与 Al2 O3陶瓷的直接粘接 ,重点考察了温度和压力对界面粘接强度的影响。在温度 72 5℃ ,压力 7.5 MPa,粘接时间 30 0 s的条件下 ,获得最大粘接强度为 15 .Joining of alumina ceramics to copper was investigated with a self made producing device. Studies were focused on temperatures, pressures and interfacial cohesive strength. The highest joining strenth of 15.1 MPa was obtained for the sample under the conditions of 725 ℃ for joining temperature, 7.5 MPa for joining pressure and 300 s for joining time.

关 键 词：铜 陶瓷 粘接 氧化铝 温度 应力 界面粘接强度 

分 类 号：TG496[金属学及工艺—焊接]