碳化硼颗粒增强Cu基复合材料的研究  

Studies of B_4C Particles Reinforced Copper Matrix Composite

作　　者：李国禄[1] 姜信昌[1] 温鸣[1] 曹晓明[1] 吕玉申[1] 

机构地区：[1]河北工业大学材料学院,天津300130

出　　处：《材料工程》2001年第8期32-35,共4页Journal of Materials Engineering

摘　　要：研究了用表面涂覆含钛金属涂层的碳化硼颗粒增强 Cu基复合材料 [B4Cp/(Ti B2 +Ti N) /Cu],并与未经涂覆的 B4C颗粒增强 Cu基复合材料 (B4Cp/Cu)进行了对比。实验结果表明 ,前者的致密度和电导率比后者好。磨损实验结果表明 ,使用有涂层颗粒的复合材料的耐磨性比无涂层颗粒的好。通过对复合材料界面和磨损表面的电镜观察表明 ,B4C颗粒经过涂覆处理后 ,改善了复合材料的界面粘结性能 。The B 4C particles containing titanium metal coating reinforced copper matrix composite(B 4C p/(TiB 2+TiN)/Cu) was investigated and compared with B 4C particles reinforced copper matrix composite(B 4C p/Cu) The experimental results show that the density and conductance of the former were better than which of the later The wear experimental results show that the wear resistance of the former is better than that of the later The interface of composites and worn surface were observed and analyzed The results indicate that the coating modification of B 4C particles has improved interfacial bonding property of composite There is good wettability between the particle and matrix

关 键 词：碳化硼 微颗粒 涂层 CU基复合材料 耐磨性 铜基复合材料 颗粒增强 

分 类 号：TB333[一般工业技术—材料科学与工程]