镁合金基体上镍磷镀层的阳极退除  

Anodic Stripping of Ni-P Coating on Mg Alloy Substrate

作　　者：刘新宽[1] 向阳辉[1] 胡文彬[1] 丁文江[1] 

机构地区：[1]上海交通大学材料科学与工程学院,上海200030

出　　处：《电镀与环保》2001年第4期6-9,共4页Electroplating & Pollution Control

摘　　要：采用阳极退除方法退除镁合金上化学镀镍磷镀层 ,研究了退除液成分对镀层退除的作用 ,对常用的镁合金化学镀镍层的退除工艺 (HF +NaNO3 )进行了改进。退镀液中含有一定浓度的F-,可保护基体不受腐蚀 ;溶液中的NaNO3 对保护膜起破坏作用 ;Anodic stripping is employed to remove electroless Ni P coating on Mg alloys. The effect of the components of the stripping solution on the stripping of coating is studied. Improvements are made on conventional electroless Mg alloy coating stripping process (HF+NaNO 3). The stripping solution contains F -, which can protect the substrate from corrosion; NaNO 3 in the solution would destroy the protective film, and the formed protective film mainly consists of MgF 2.

关 键 词：镁合金 化学镀 镀层 退镀 电镀 镍磷镀层 

分 类 号：TQ153[化学工程—电化学工业]