轧制及扩散温度对Ag/Cu层状复合材料结合性能的影响  

Effect of roll bonding and diffusion treatment temperature on bond properties of Ag/Cu bimetallic laminates

作　　者：孟亮 周世平[2] 杨富陶[2] 沈其洁[2] 刘茂森[1] 

机构地区：[1]浙江大学金属材料研究所,杭州310027 [2]昆明贵金属研究所,昆明650221

出　　处：《中国有色金属学报》2001年第6期982-987,共6页The Chinese Journal of Nonferrous Metals

基　　金：云南省省校科技合作资助项目 ( 98YZ -0 0 2 )

摘　　要：在不同温度进行轧制复合及扩散处理制备了Ag/Cu层状复合材料 ,研究了反复弯曲载荷条件下材料结合性能与复层基体硬度及界面区域微观组织的关系。温度合适的复合及扩散可使材料基体具有充分的再结晶组织、较低的硬度、致密的界面结合形态 ,因而能使材料具有较优良的结合性能。温度过高的复合及扩散处理可导致界面上存在较厚的氧化层及较多的空洞 ,基体内也会形成粗大晶粒 ,这些均会明显损害结合性能。The Ag/Cu bimetallic laminates were prepared by roll bonding and diffusion treatment at different temperatures. The dependence of the bond properties under the repeatedly bonding condition on the matrix hardness of strip components and the microstructure in interface region was investigated. The bonding and diffusing at optimum temperatures produce the high bond properties because the laminates show full recrystallization, low hardness and tightly bonding interface. Bonding and diffusing to excessively high temperature result in the thick oxide layer on the interface, more pores along the interface and coarse grains in the matrixes Ag and Cu. Consequently, the bond properties may be reduced significantly.

关 键 词：银/铜复合材料 轧制复合 扩散温度 结合性能 

分 类 号：TB331[一般工业技术—材料科学与工程]