倒相式音箱的SPICE模型的建模与仿真  

Building and Simulation of SPICE Model for Vented－box

作　　者：何亚宁 

机构地区：[1]香港科汇有限公司成都代表处,四川成都610041

出　　处：《电声技术》2001年第8期15-22,共8页Audio Engineering

摘　　要：在倒相式音箱电－力－声原始类比电路的基础上，建立一个通用的倒相式音箱低频等效电路的SPICE模型，从而可以方便地采用SPICE软件对电路和倒相式音箱混合的各种复杂系统进行计算机仿真和优化。A general SPICE model of the vented－box loudspeaker system low frequency analogy circuit is built based on the original electric，mechanic and acoustic analogy circuit． So the computer simulation and optimization of all kinds of complex systems that include circuit and vented－box can easily be done by the software of SPICE．

关 键 词：SPICE模型 建模 计算机仿真 倒相式音箱 

分 类 号：TN912.26[电子电信—通信与信息系统] TP391.9[电子电信—信息与通信工程]