硼酸钠/甲阶酚醛树脂配合物的热固化过程和耐热性  

Thermocuring and Heat Resistance of the Complexes of Sodium Borate with Phenol-Formaldehyde Resin

作　　者：谭晓明[1] 黄乃瑜[1] 谢洪泉[2] 

机构地区：[1]华中科技大学材料科学与工程学院,武汉430074 [2]华中科技大学化学系,武汉430074

出　　处：《应用化学》2002年第1期76-79,共4页Chinese Journal of Applied Chemistry

摘　　要：利用热分析法和红外分析法 ,研究了硼酸钠 /甲阶酚醛树脂配合物的热固化反应过程和耐热性 .结果表明 :配合物的热固化是一个放热反应 ;在加热的条件下 ,配合物中没有参与配位的苄羟基发生缩合反应 ,生成了亚甲基或羰基 ;固化过程中有小分子放出使配合物快速失重 ;配合物的耐热性能随着硼酸钠用量的增加而增强 .Thermocuring and heat resistance of the complexes of sodium borate with phenol-formaldehyde resol resin were studied by thermal analysis and infrared spectroscopy. The results showed that the curing process is an exothermal reaction. On heating, condensation reaction of the hydroxymethyl groups in the complexes takes place and forms methylenes or carbonyl groups. With increase of sodium borate in the complexes the heat resistance of the complexes increases significantly.

关 键 词：甲阶酚醛树脂 硼酸钠 配合物 热固化 耐热性 粘结剂 

分 类 号：TQ433.431[化学工程]