n-型梯度结构热电材料FeSi_2/Bi_2Te_3的制备与性能研究  

The preparation and performance of n-type FeSi_2/Bi_2Te_3 segmented thermoelectric material

作　　者：崔教林[1] 赵新兵[1] 朱铁军[1] 胡淑红[1] 

机构地区：[1]浙江大学材料科学与工程系,浙江杭州310027

出　　处：《功能材料》2001年第4期437-439,共3页Journal of Functional Materials

基　　金：国家自然科学基金资助项目 (59971 0 4 4 )

摘　　要：采用热浸焊法用纯Sn作为过渡层制备了n 型FeSi2 /Bi2 Te3梯度结构热电材料并对其热电性能进行了测试。发现当冷热端温度在 5 10℃以下时 ,梯度结构热电材料的表观Seebeck系数随平均温度几乎呈线性分布在同一条带形区域内 ,并在相同的温度范围内 ,其值显著高于单种均质材料 (Bi2 Te3和 β FeS i2 )。梯度结构热电材料的最大输出功率较单种材料高 2～ 2 .5倍以上 ,且当材料经 190℃ 10 0h与 2 0 0h的真空退火后 ,输出功率几乎不变。金相分析表明 ,在Sn层与两半导体界面处 ,没有明显的Sn扩散迹象 ,说明在所试验的条件下 ,用Sn作为过渡层热稳定性较好。The segmented thermoelectric material of n type β FeSi 2/Bi 2Te 3 has been prepared by means of dip coating procedure and using pure tin as the bridge material. It was found that the apparent Seebeck coefficients of the segmented materials were in direct proportional to the average temperature applied between hot and cold side, which was obviously higher than those of the monolithic ones (β FeSi 2 and Bi 2Te 3) in the same temperature range. The measurements showed that the maximum power outputs of the segmented materials were about 2 to 2.5 times of the monolithic ones, and remained unchanged when the materials have been annealed at 190℃ for 200h. The microstructure of the interfaces show no visible diffusion of tin in the semiconductor matrixes.

关 键 词：热电性能 梯度结构材料 输出功率 锡过渡层 

分 类 号：TN37[电子电信—物理电子学] TB34[一般工业技术—材料科学与工程]