Cu/Mo/Cu爆炸复合界面组织特征  

Microstructure of Cu/Mo/Cu Explosive Clad Interface

作　　者：杨杨[1] 李正华[2] 程信林[1] 朱筱北[1] 裴大荣[2] 高文柱[2] 

机构地区：[1]中南大学,湖南长沙410083 [2]西北有色金属研究院,陕西西安710016

出　　处：《稀有金属材料与工程》2001年第5期339-341,共3页Rare Metal Materials and Engineering

基　　金："95"国家经贸委资助项目

摘　　要：用爆炸复合的方法 ,试制出了 Cu/Mo/Cu板材。用光学显微镜和扫描电镜研究了其界面组织特征 ;并利用显微硬度考察了界面附近硬度及界面附近的形变特点。结果表明 :Cu/Mo/Cu复合材具有波形结合面和平直结合面 ;波形界面存在熔区 ,其熔区的显微硬度高于 Cu基体而低于Cu/Mo/Cu(CMC) laminate is a new kind of composite with highl electrical conductivity and thermal conductivity. Especially, the CTE (coefficient of thermal expansion) of the laminate can be tailored by changing the cladding ratio, so a significant amount of CMC sheet is used in electronic industry for substrates of integrated circuits. At present, it is an ideal material to replace the pure molybdenum sheet. In this study, CMC laminate was produced with explosive cladding technique. The interface's morphology and microstructure were observed by means of CM. SEM. Microhardness measurements revealed the feature of deformation zone.

关 键 词：界面 爆炸复合 组织特征 铜/钼/铜层状复合材料 

分 类 号：TB331[一般工业技术—材料科学与工程]