等离子体表面技术和在有机材料改性应用中的新进展  

DEVELOPMENT IN LOW-TEMPERATURE PLASMA TECHNIQUE AND APPLICATION TO SURFACE MODIFICATION OF ORGANIC MATERIALS

作　　者：杨超[1] 邱高[1] 

机构地区：[1]东华大学应用物理系,上海200051

出　　处：《高分子材料科学与工程》2001年第6期30-34,共5页Polymer Materials Science & Engineering

摘　　要：综述了 2 0世纪 90年代以来低温等离子体表面技术及其在有机材料改性应用中的新进展。介质阻挡放电和远等离子体处理是实现工业化和获得更好的等离子体表面改性的新方法。目前的研究更多地关注于等离子体接枝表面改性 ,即将不同性能的单体接枝于用等离子体处理过的材料表面获得永久性表面改性 ,以提高材料的粘附性、吸湿性、吸附性、导电性和生物相容性等。The recent development in low temperature plasma technique and application to surface modification of organic materials were reviewed with 35 references. The dielectric barrier discharge and remote plasma treatment have been improved to accomplish industrial application and obtain preferable result of plasma surface modification. Recently, more interest was focussed on the graft copolymerization with various monomers onto the plasma pretreated materials to obtain permanent surface modification achieve surface behaviors such as the adhesion, wettability, adsorption, conductivity and biocompatibility etc. Furthermore, the prospect in low temperatme plasma technique was commented.

关 键 词：低温等离子体 有机材料 表面改性 进展 

分 类 号：O539[理学—等离子体物理] O621[理学—物理]