双马来酰亚胺/溴化环氧树脂基覆铜箔板的研制  

Preparation of Bismaleimide/Bromic Epoxy Based Copper Clad-Laminate

作　　者：赵磊[1] 梁国正[1] 孟季茹[1] 

机构地区：[1]西北工业大学,陕西西安710072

出　　处：《绝缘材料》2002年第1期5-8,共4页Insulating Materials

摘　　要：以 4 ,4’-双马来酰亚胺基二苯甲烷、二烯丙基双酚 A、溴化环氧树脂、双氰胺等为主要原料 ,采用预聚法工艺获得性能优良的改性树脂体系。以玻璃纤维为增强材料 ,改性树脂为基体树脂 ,丙酮为主要溶剂 ,通过试验及分析确定了最佳的树脂配方体系 ,制备了贮存稳定性优良的胶液和半固化片。半固化片经合适的压制工艺热压得到的覆铜箔板具有较佳的力学和电气性能。对覆铜箔板成型工艺中胶液的配制、浸胶、干燥及热压工艺进行了研究 ,确定了各道工序的主要影响因素并最终确定了适宜的成型工艺。利用 DSC等手段对改性树脂体系的凝胶特性、固化工艺等进行了初步研究。The authors obtained a modified resin system with high performance for copper clad laminate,which was prepared from 4,4' diphenylbismaleimide,diallylbisphenol A,bromic epoxy and dicyandiamide with suitable proportion and pre polymerization.Using the modified resin system as matrix,glass fiber as reinforcement,and acetone as main solvent,the impregnant and half cured sheet with fine properties were prepared according to experiment and analysis results.With corresponding heat laminating process,the copper clad laminate shows good mechanical and dielectric properties.The authors also studied the gel time,curing processibity by DSC and other apparatus,as well as the confect of impregnant,impregnating,dryness and lamination processing of the copper clad laminate.

关 键 词：双马来酰亚胺树脂 溴化环氧树脂 覆铜箔层压板 热稳定性 电气性能 印制电路板 

分 类 号：TN41[电子电信—微电子学与固体电子学]