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作 者:鲁道荣[1] 何建波[1] 李学良[1] 胡惠媛[1]
出 处:《合肥工业大学学报(自然科学版)》2001年第6期1053-1056,共4页Journal of Hefei University of Technology:Natural Science
基 金:安徽省自然科学基金资助项目 ( 986 2 5 2 48)
摘 要:文章介绍实验模拟铜电解精炼的工业生产条件 ,在小型电解槽中研究脉冲电流法电解精炼铜的可行性 ,并用 XRD、SEM及等离子体质谱仪研究杂质对阴极铜沉积的结构和组成的影响。研究表明 ,当电解温度为 6 0℃时 ,脉冲电解较适宜的工艺条件为 :峰电流密度 396 0 A/ m2 ,脉冲宽度 0 .5 m s,脉冲频率 333Hz,占空比 1∶ 5。添加剂用量 :Cl-3.0 m g/ dm3 ,( N H2 ) 2 CS 0 .75~ 1.0 mg/ dm3 ,glue 1.0~ 1.5 m g/ dm3 。电解液中有害杂质容许量 :As5+ ≤ 2 .0 g/ dm3 ,Sb3 + ≤ 0 .2 0 g/ dm3 ,Bi3 + ≤ 0 .10 g/ dm3。测试结果表明 ,当电解液中不含杂质时 ,铜沉积的晶面择优取向为 ( 2 0 0 ) ,结晶形态为层状 ;电解液中含杂质时 ,铜沉积的晶面择优取向为 ( 2 2 0 ) ,结晶形态为层状 +块状。In this paper, through simulating the industrial condition,the feasibility of the copper electrorefining by pulse electrolysis method is studied with high current density in a small cell, and the effect of the impurity on the structure and composition of the copper deposition is investigated by XRD,SEM,and Icp Ms. It is found that when the electrolysis temperature is 60 ℃,the better pluse electrolysis conditions are as follows: the peak current density 3 960 A/m 2,pluse width 0.5 ms, pluse frequency 333 Hz,and pluse duration ratio 1∶5. The best quantity of the additives is Cl - 3.0 mg/dm 3,(NH 2) 2 CS 0.75~1.0 mg/dm 3, and glue 1.0~1.5 mg/dm 3 respectively. The allowable quantity of impurities in electrolyte is As 5+ ≤2.0 g/dm 3,Sb 3+ ≤0.20 g/dm 3,and Bi 3+ ≤0.10 g/dm 3 respectively. The test shows that without impurity the cathodic copper deposition preferred orientation is (200) and the electrocrystal formation is smectic state, with impurity the copper deposition preferred orientation is (220) and the electrocrystal formation is smectic and block state.
关 键 词:铜电解精炼 脉冲电流法 结晶形态 晶面择优取向 铜沉积表面状况 微观结构 可行性
分 类 号:TF811[冶金工程—有色金属冶金] TF804.4
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