CuCr_(50)Te/Cu双层触头材料烧结变形的研究  

Study On Sintering Defomation of CuCr_(50) Te/Cu Double Layer Material

作　　者：傅肃嘉 吴仲春 方敏 曾杰 陶应启 

机构地区：[1]浙江省冶金研究院,杭州310013

出　　处：《电工材料》2001年第4期7-12,共6页Electrical Engineering Materials

摘　　要：本文通过对不同相对密度下 Cu及 Cu Cr50 Te粉末压制材料在 10 5 0℃烧结时收缩率的测定 ,分析了 Cu Cr50 Te/ Cu双层触头材料产生烧结变形的原因。通过选择适当的压制压力 ,减少 Cu层与Cu Cr50 Te层材料之间的烧结收缩率差别 ,解决了烧结变形问题。同时还提出了粉末压烧材料的相对密度与收缩率的经验关系方程 ,并根据实验结果进行了验证。The sintering shrinkage ratio of Cu and CuCr 50 Te preformed materials sintered at 1050℃ was determined with different relative density. The reason of sintering deformation of CuCr 50 Te/Cu double layer material was analyzed. It is found that the bend of CuCr 50 Te/Cu double material due to sintering deformation could be resolved by choosing suitable press pressure. An experiential equation on the relationship between the relative density and the sinter shrinkage ratio in preformed materials was presented and verified with the experimental data.

关 键 词：粉末冶金 双层材料 复合触头材料 烧结变形 

分 类 号：TM503.5[电气工程—电器] TF124.1[冶金工程—粉末冶金]