含表面半椭圆裂纹板裂纹尖端应力强度因子的三维光弹分析  

Three Dimensional Photoelastic Determination of K_I for Surface Semi-elliptic Crack in Plates

作　　者：黎之奇[1] 柳春图[1] 胡振威[2] 

机构地区：[1]中国科学院力学所 [2]香港大学

出　　处：《实验力学》1991年第4期347-354,共8页Journal of Experimental Mechanics

基　　金：国家基金委

摘　　要：本文用三维光弹法得到了含表面半椭圆裂纹板拉伸载荷下应力强度因子 K_Ⅰ沿整个裂纹前缘的分布及由不同裂纹深度引起的有限厚度效应,得到的实验结果与理论结果进行了比较和分析,并对角点上的奇异性进行了定性分析.By three dimensional freezing photoelastic method,stress intensity factors K_I in plates with surface semi-elliptical crack under a tensile load are determined.The effects of dif- ferent depths of crack are obtained and compared with numerical solutions.The singularity at the intersections between the free surface and the crack front is discussed.

关 键 词：应力强度因子 表面裂纹 三维光弹法 

分 类 号：O348.1[理学—固体力学]