COM+事件模型在多层结构中的应用  

COM+ Events Model Applied in Multilayer Structure

作　　者：郭学俊[1] 段智勇[1] 朱跃龙[1] 

机构地区：[1]河海大学计算机及信息工程学院,南京210098

出　　处：《计算机工程》2002年第2期93-95,共3页Computer Engineering

摘　　要：主要介绍了+的基于发布/订阅的松耦合事件模型结构及其技术特点,并通过对比的基于连接指针的紧耦合事件模型,COMCOM指出紧耦合事件模型存在的不足之处,从中说明+事件模型在多层结构的软件应用中是一种更先进和实用的事件解决方案。The paper mostly introduces the loosely coupled events model structure based on publish/subscribe of COM+ and its technology characteristic, indicates the shortages of COM tight coupling events model by compare COM+ events model with COM events model based on connection points and account for the COM+ events model is a more advanced and more applied events resolve scheme in multilayer structure software apply.

关 键 词：COM+ 松耦合 事件模型 多层结构 应用程序 网络互连 计算机网络 

分 类 号：TP393.03[自动化与计算机技术—计算机应用技术]