有机硅导热材料的主要组成剖析方法  

The Analytical Approach to Components of Silicone Heat-conductive Materials

作　　者：葛建芳[1] 钟冬晖[1] 王雪梅[2] 

机构地区：[1]茂名学院石油化工系,广东茂名525000 [2]茂名石油化工公司,广东茂名525000

出　　处：《茂名学院学报》2001年第3期50-52,共3页Journal of Maoming College

摘　　要：对某导热灌封材料的主要组成进行剖析 ,并建立一种有机硅材料的定性分析方法。分析结果表明 ,灌封材料主要是以乙烯基硅氧烷和含氢硅氧烷为基料 ,并加有α -Al2 O3The anyalysis of one kind of potting compund is conducted,and the method of qualitative analysis of silicone materials is proposed by this way.It is concluded that the potting compound,as one kind of functional composite,is composed primarily of vinylsilane and hydrogensilane as base components which are blended with heat conductive filler α-Al 2O 3.

关 键 词：硅氧烷 Α-AL2O3 定性分析 有机硅导热材料 组成 氧化铝 

分 类 号：TQ264.1[化学工程—有机化工]