电子芯片厂房华夫板楼板施工技术  

Floor Construction Technology of Waffle Board in Electronic Chip Workshop

作　　者：孙殿文 Sun Dian-wen

机构地区：[1]北京博大经开建设有限公司,北京100176

出　　处：《建筑技术开发》2018年第20期33-34,共2页Building Technology Development

摘　　要：某电子芯片厂房为钢筋混凝土框架剪力墙结构,二层顶板为华夫板,面积约为3.2万m2,分为600 mm和800 mm两种厚度。华夫板满布直径为350 mm孔洞,采用铝合金筒模技术,有效地解决了粘模的问题,由于板较厚,华夫板支撑体系需通过专家论证后方可支设。An electronic chip workshop is a reinforced concrete frame shear wall structure,with a roof of waffle plate on the second floor and an area of about 32000m^2,divided into two types of thickness :600mm and 800mm.The full diameter of the waffle plate is 350mm,and the aluminum alloy tube mold technology is adopted to effectively solve the problem of the adhesive mold.Due to the thicker waffle plate,the support system of waffle plate can only be set up after expert demonstration.

关 键 词：华夫板 铝合金筒模 支撑体系 

分 类 号：TU745[建筑科学—建筑技术科学]