雾化气氛对球形焊锡粉形貌粒度的影响研究  

Influence of atomization atmosphere on morphology and particle size of spherical solder powder

作　　者：普友福 段雪霖 PU You-fu;DUAN Xue-lin(YunnanTin Group (Holding)Company Limited R&D Center,Kunming 650106,China;Tin Company,Kunming 650217,China)

机构地区：[1]云锡研发中心,云南昆明650106 [2]锡材公司,云南昆明650217

出　　处：《粉末冶金工业》2018年第6期19-22,共4页Powder Metallurgy Industry

摘　　要：球形焊锡粉的形貌和粒度对焊膏产品具有重要影响。对球形焊锡粉的雾化气氛进行试验研究,对比了空气、氦气、氮气、氩气、氮氦气混合、氮氩气混合气氛下雾化焊锡粉的显微形貌及粒度分布。结果表明,雾化气氛中的氧含量是影响粉末球形度、平均粒度和粒度分布的关键因素,综合比较得出,氮气较适合球形焊锡粉的离心雾化生产。The morphology and particle size of spherical solder powder have an important influence on solder paste products. The atomization atmosphere of spherical solder powder was experimentally studied. The morphology and particle size distribution of atomized solder powder in the atmosphere of air, helium, nitrogen, argon, nitrogen and helium mixed and nitrogen and argon mixed were compared. The results show that the oxygen content in the atomization atmosphere is the key factor affecting the sphericity, average particle size and particle size distribution of the powder. A comprehensive comparison shows that nitrogen is more suitable for centrifugal atomization production of spherical solder powder.

关 键 词：焊锡粉 离心雾化 粉末形貌 雾化气氛 

分 类 号：TG42[金属学及工艺—焊接] TN41[电子电信—微电子学与固体电子学]