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作 者:Shiwei Liang Jun Wang Fang Fang Linfeng Deng
机构地区:[1]College of Electrical and Information Engineering, Hunan University
出 处:《Journal of Semiconductors》2018年第12期81-84,共4页半导体学报(英文版)
基 金:Project supported by the National Natural Science Foundation of China(No.51577054)
摘 要:Power integration based on 4 H-SiC is a very promising technology for high-frequency and high-temperature power electronics applications. However, the fabrication processes used in Si BiCMOS technology is not applicable in 4 H-SiC at present, and few studies on the monolithic power integration of the SiC signal devices and power devices have been reported. In this paper, we propose a novel lateral BJT structure, which is suitable for monolithically integrating with the vertical power BJT on the same epitaxial wafer at the cost of one additional mask. The signal BJT’s static and dynamic characteristics are comprehensively investigated by TCAD simulation.Simulation results show that the common-emitter current gains of the 4 H-SiC signal BJT are 133 and 52 at room temperature and 300 ℃, respectively. Its implementation in an inverter shows that its switching time is about200 ns.Power integration based on 4 H-SiC is a very promising technology for high-frequency and high-temperature power electronics applications. However, the fabrication processes used in Si BiCMOS technology is not applicable in 4 H-SiC at present, and few studies on the monolithic power integration of the SiC signal devices and power devices have been reported. In this paper, we propose a novel lateral BJT structure, which is suitable for monolithically integrating with the vertical power BJT on the same epitaxial wafer at the cost of one additional mask. The signal BJT's static and dynamic characteristics are comprehensively investigated by TCAD simulation.Simulation results show that the common-emitter current gains of the 4 H-SiC signal BJT are 133 and 52 at room temperature and 300 ℃, respectively. Its implementation in an inverter shows that its switching time is about200 ns.
关 键 词:SiC BJT integrated circuit current gain power integration
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