焦磷酸钾-HEDP体系无氰仿金电镀工艺研究  

Study on Electroplating Process of Cyanide-free Gold in Potassium Pyrophosphate-HEDP

作　　者：郑丽 罗松 袁诗琳 段进雄 ZHENG Li;LUO Song;YUAN Shilin;DUAN Jinxiong(College of Materials Science and Engineering,Sichuan University of Science &Engineering,Zigong 643000,China)

机构地区：[1]四川理工学院材料学院

出　　处：《热加工工艺》2018年第22期143-146,共4页Hot Working Technology

基　　金：材料腐蚀与防护四川省重点实验室开放基金科研项目(2017CL08,2017CL07);四川理工学院人才引进项目(2017RCL17);大学生创新创业训练计划项目(cx2017002)

摘　　要：在镀液基本组成为焦磷酸钾(260 g/L)、焦磷酸铜(18 g/L)、焦磷酸亚锡(2.0 g/L),电镀工艺条件为电流0.15A,温度30℃,pH=9~10,电镀5 min,和空气搅拌的条件下,利用正交实验探究羟基乙叉二膦酸(HEDP)、酸铜走位剂(AESS)和K2CO3对无氰仿金电镀镀层颜色的影响。对正交结果进行分析,最终得出HEDP、AESS、K2CO3的最优组合为:HEDP:15 g/L,K2CO3:40 g/L,AESS:24×10-3g/L。对以上组合所得到的镀层形貌、厚度、成分、相组成进行。该配方可获得Hull槽试片上全范围光亮的仿金镀层,且镀层表面平整,镀层厚度约为1.5μm。Sn在镀层中主要以Cu13.7Sn的形式存在,且为立方结构。The bath composition for Cu-Sn alloy coating is as follows:K4P2O7·3H2O(260 g/L),Cu2P2O7·3H2O(18 g/L),Sn2P2O7(2.0 g/L).The process conditions for Cu-Sn alloy coating is as follows:cathodic current 0.15 A,temperature 30℃,pH=9-10,electroplating for 5 min.By air agitation,under the given process conditions,an orthogonal experiment was designed to investigate the effects of HEDP,AESS and K2CO3 on colour of gold plating in pyrophosphate-HEDP solution.The results of the orthogonal experiment show that the optimal plating composition is HEDP:15 g/L,K2CO3:40 g/L,AESS:24×10-3g/L.The surface morphology,thickness,composition and phase of the coating prepared by using the optimal formula were analyzed.A white bright coating of the test piece prepared in the hull cell can be obtained by the optimal formula.The surface of the plating coating is flat.Its thickness is about 1.5μm.The element of Sn in the coating exists in the form of Cu13.7Sn with a cubic crystal structure.

关 键 词：正交实验 仿金电镀 焦磷酸钾-HEDP 

分 类 号：TG174[金属学及工艺—金属表面处理]