同步加速器装置中多丝束流剖面探测结构材料出气率测量  

Outgassing-Rate in Baking of Multifilament Beam Profile Monitor of Synchrotron Accelerator

作　　者：刘建龙 蔺晓建 蒙峻[1] 杨伟顺[1] 高彦民 万亚鹏 张喜平[1] 李长春 Liu Jianlong;Lin Xiaojian;Meng Jun;Yang Weishun;Gao Yanmin;Wan Yapeng;Zhang Xiping;Li Changchun(Institute of Modern Physics,Chinese Academy of Science,Lanzhou 730000,China)

机构地区：[1]中国科学院近代物理研究所,兰州73000

出　　处：《真空科学与技术学报》2018年第12期1029-1032,共4页Chinese Journal of Vacuum Science and Technology

摘　　要：简要阐述了基于小孔流导法的SPP方法测量实验样品材料出气率的实验方法及装置,测量了同步加速器中多丝结构材料在常温及100、150、200℃的烘烤温度下保温48 h的出气速率,并测量了不同烘烤温度下保温结束降至室温48 h后多丝结构的出气速率,确定了该多丝结构材料的适宜烘烤温度为150℃,为多丝结构材料在真空系统中的使用提供了设计依据。We experimentally addressed optimization of the backing conditions of synchrotron accelerator vacuum chamber installed with the beam profile monitor,comprising the gold-plated tungsten multifilament belt insulated with poly(ether-ether-ketone)(PEEK)coatings.The influence of the backing temperature and holding time on the outgassing rate was investigated with small-hole flow model in switching dual pumping path method (SPP).The results show that the optimized baking conditions included:a baking temperature of 150℃,a high temperature holding time of 24h and a cooling time of 24h.Baking at 150℃ greatly outperformed backing at 200℃,because of a much lower outgassing rate after cooling down to room temperature.Baking at 250℃ was found to seriously deform (or damage)the PEEK coatings of the multifilament beam profile monitor.

关 键 词：出气率 SPP方法 多丝结构 真空烘烤 

分 类 号：TB75[一般工业技术—真空技术]