酸性镀铜柱状结晶成因及其对PCB性能的影响  

Causes of columnar crystal formation in acid copper plating and its influence on PCB performance

作　　者：白坤生 李思周 陈凯 Bai Kunsheng;Li Sizhou;Chen Kai

机构地区：[1]广东成德电子科技股份有限公司,广东佛山528300

出　　处：《印制电路信息》2019年第1期31-34,共4页Printed Circuit Information

摘　　要：讨论了酸性镀铜柱状结晶的形成原因,及其对PCB镀层性能的影响。研究发现,在光亮剂浓度及基础镀液浓度相同的前提下,降低电流密度会导致酸性镀铜柱状结晶形成的风险加大。在其他条件相同时,光亮剂浓度越高,越容易产生柱状结晶。柱状结晶不一定会导致孔铜的断裂开路,但对PCB镀层物理性能有潜在负面作用。The formation reason of columnar crystals of acid copper plating and its influence on the properties of PCB coating were discussed. The study found that, on the premise of the same concentration of brightener and base plating solution, lowering the current density would increase the risk of columnar crystals formation in acid copper plating.When other conditions were the same, the higher the concentration of brightener, the easier it was to produce columnar crystals. Columnar crystals did not necessarily lead to open-circuit fracture of hole copper, but had potential negative effects on the physical properties of PCB coating.

关 键 词：酸性镀铜 柱状结晶 成因 性能 

分 类 号：TN41[电子电信—微电子学与固体电子学]