铜/钼熔接接头的结合性能研究  

Research on Bonding Properties of Cu/Mo Fusion Welded Joints

作　　者：董运涛 樊科社 吴江涛 邹军涛[2] 陈迪春[2] DONG Yuntao;FAN Keshe;WU Jiangtao;ZOU Juntao;CHEN Dichun(Western Metal Materials Co.,Ltd.,Xi'an 710065,China;School of Materials Science and Engineering,Xi'an University of Technology,,Xi'an 710048,China)

机构地区：[1]西部金属材料股份有限公司,陕西西安710065 [2]西安理工大学材料科学与工程学院,陕西西安710048

出　　处：《铸造技术》2019年第1期1-3,共3页Foundry Technology

摘　　要：采用熔接方法制备了铜/钼接头,并对其进行了静态拉伸试验,借助光学显微镜(OM)、扫描电子显微镜(SEM)和X射线能谱仪(EDS)分析了结合界面附近的显微组织、化学成分和断口形貌。结果表明,室温静拉伸条件下,铜/钼熔接接头在158 MPa时由钼侧产生脆性断裂,断口特征为解理+沿晶;结合界面附近形成了宽度为0.2～1.0μm的扩散区,其原子百分比约为1∶1。Cu/Mo joints were prepared by melt infiltration technique and their boding properties were tested by static tensile test. Microstructure, chemical composition, and fracture morphology near the Cu/Mo interface were analyzed by optical microscopy(OM), X-ray dispersion spectrometer(EDS) and scanning electron microscopy(SEM), respectively. The results show that the joints fractured by means of fragile fracture and intergranular fracture at the side of Mo at the load of158 MPa, a diffusion region of Cu and Mo with the width of 0.2~1.0 μm formed in the interfacial region, and the atomic ratio of Cu and Mo in the diffusion region is about 1∶1.

关 键 词：铜/钼接头 熔接 结合性能 

分 类 号：TG115[金属学及工艺—物理冶金]