相变薄膜热物性对电子设备热控的影响  

Influence of Physical Parameters of Phase-change Film on Thermal Control of Electronic Devices

作　　者：毛丽凯 程文龙[1] 年永乐[1] MAO Li-kai;CHENG Wen-long;NIAN Yong-le(Department of Thermal Science and Energy Engineering, University of Science and Technology of China,Hefei 230000,China)

机构地区：[1]中国科学技术大学热科学和能源工程系,安徽合肥230000

出　　处：《电子机械工程》2018年第6期27-31,35,共6页Electro-Mechanical Engineering

摘　　要：相变热控技术是被动热控的重要方法之一。文中对利用柔性相变薄膜材料进行电子设备热控进行了实验研究和数值模拟,获得了相变材料热物性参数和结构参数对热控性能的影响规律。研究结果表明,相变材料的比热容和相变潜热对热控性能的影响较小,材料的热导率、厚度以及来自芯片的热流密度和热源面积因子对热控有较大影响;当系统达到热平衡时,热源中心温度与相变材料热导率、厚度以及热源面积因子成负相关,与热流密度成正相关。Phase change thermal control technology is one of the important methods for passive thermal control.The experimental research and numerical simulation for the thermal control of electronic equipment using flexible phase change film materials are carried out,and the influence of the physical parameters of phase-change materials and the experimental parameters on the thermal control are obtained.The results show that the specific heat capacity and the latent heat of the phase-change material have little effects on thermal control,while the thermal conductivity and the thickness of the phase-change material,the heat flux from the chip and the heat source area factor have a large influence on thermal control.When the system reaches thermal balance,the central temperature of the heat source is negatively correlated with the thermal conductivity and the thickness of the phasechange material and the heat source area factor,and is positively correlated with the heat flux.

关 键 词：柔性相变材料 相变热控 电子器件 物性参数 

分 类 号：TK124[动力工程及工程热物理—工程热物理]