机载大长宽比风冷均温冷板优化设计  

Optimization Design of Airborne Air Cooling Plates with High Aspect Ratio

作　　者：张笑凡 邹吾松 陈泽彪 ZHANG Xiao-fan;ZOU Wu-song;CHEN Ze-biao(AVIC Leihua Electronic Technology Research Institute,Wuxi 214063,China)

机构地区：[1]中国航空工业集团公司雷华电子技术研究所,江苏无锡214063

出　　处：《电子机械工程》2018年第6期36-38,59,共4页Electro-Mechanical Engineering

摘　　要：大长宽比冷板在机载电子设备中应用广泛。文中在现有风冷散热技术的基础上,同时采用均温板技术和非连续流道技术设计了一种全新的大长宽比机载风冷均温冷板。对该风冷均温冷板进行了数值仿真分析,并与普通的风冷散热冷板进行了对比。同时,对其进行了散热试验,并与数值仿真结果进行了进一步对比分析。结果表明,该风冷散热冷板具有2个特点:对冷却风资源利用充分,因而散热效率较高;工作时表面的温度一致性较好。The airborne air cooling plates with high aspect ratio are widely applied in the airborne electronic devices.A new type of air cooling plates is designed in this paper based on the existing air cooling technology,adopting two key technologies:the vapor chamber technology and the discontinuous flow-path technology.Numerical simulations and heat dissipation experiments are carried out for the new cooling plates.The simulation results are compared with the heat dissipation experiment result and that of the ordinary air cooling plates.The results show that the new air cooling plates have the advantages of high cooling efficiency for fully used cooling air and good consistency of the surface operation temperature.

关 键 词：风冷 均温板 非连续流道 

分 类 号：TK414.2[动力工程及工程热物理—动力机械及工程]