食用菌菌糠生物质建筑保温板性能研究  

Experimental study on performance of biomass insulation board with edible fungus chaff

作　　者：渠继红 姜鲁[1] 李珠[1] QU Jihong;JIANG Lu;LI Zhu(Taiyuan University of Technology,Taiyuan 030024,China)

机构地区：[1]太原理工大学,山西太原030024

出　　处：《新型建筑材料》2019年第2期105-108,共4页New Building Materials

摘　　要：食用菌菌糠的资源化利用可有效缓解其对周边环境的污染,研究了不同食用菌菌糠掺量、烘干温度对生物质建筑保温板强度、导热系数和体积吸水率的影响,并利用扫描电镜观测了生物质保温板的微观形貌。结果表明:随着食用菌菌糠掺量的增加,保温板的抗压强度先提高后降低,导热系数先减小后增大,当菌糠掺量为30%时,导热系数最低;烘干温度对生物质保温板性能的影响较大,随着温度的升高,强度逐渐降低,保温性能提高,对于生物质保温板建议烘干温度为100～130℃。The utilization of edible fungus chaff(EFC) can effectively alleviate its pollution to the surrounding environment. The effects of different content of EFC and drying temperature on the strength, thermal conductivity and volume water absorption of the insulation board were studied. The micro-morphology of the biomass insulation board was observed by scanning electron microscopy(SEM). The results show that with the increase of EFC content,the strength of thermal insulation board decreases gradually. The thermal conductivity decreases first and then increases. When the content of EFC is 30%,the thermal conductivity is the lowest. The drying temperature has a great influence on the performance of the biomass thermal insulation board. With the increase of temperature,the strength decreases gradually and the thermal insulation performance improves. The best drying temperature for biomass thermal insulation board is 100~130 ℃.

关 键 词：菌糠 生物质保温板 建筑保温材料 

分 类 号：TU551[建筑科学—建筑技术科学]