化学镀镍磷合金的工艺研究  

RESEARCH ON THE TECHNOLOGY OF CHEMICAL PLATING OF NICKEL-PHOSPHORUS ALLOY

作　　者：廖戎[1] 景小明[1] 岑贵俐[1] 陈若军[1] 

机构地区：[1]西南民族学院化学系,四川成都610041

出　　处：《矿物岩石》2002年第1期83-86,共4页Mineralogy and Petrology

摘　　要：研究在酸性条件下 ,用次亚磷酸钠为还原剂进行化学镀镍磷合金的工艺。并通过实验对温度、p H值、硫酸镍、次亚磷酸钠、络合剂、缓冲剂、稳定剂等影响因素作出分析 ,找出了最佳配比和最合适的镀液组成及施镀工艺。The technology of chemical plating Ni P alloy with NaH 2PO 2·H 2O as reductant under acid conditions was discussed. Through experiments, the influencing factors of temperature, pH, NiSO 4,NaH 2PO 2·H 2O, complexing reagent and buffer reagent were analysed. The best rate,the most suitable component of plating solution and the plating technology were obtained.

关 键 词：化学镀 镍磷合金 酸性条件 次亚磷酸钠 温度 pH值 络合剂 

分 类 号：TQ153.12[化学工程—电化学工业]