低温热水供暖技术推广中尚需研究解决的问题  

Some problems to be addressed in floor heating technology application

作　　者：孙德兴[1] 陈海波[1] 张吉礼[1] 

机构地区：[1]哈尔滨工业大学

出　　处：《暖通空调》2002年第3期99-102,共4页Heating Ventilating & Air Conditioning

摘　　要：对目前地板供暖中存在的地板表面发热量计算、房间热负荷、填充层最佳厚度、地板供暖与散热器供暖水系统共用热源、地板供暖配套的地面装修以及承压保温地面结构层等重要技术问题进行探讨 ,提出一些解决办法和建议 。Discusses several important technical problems facing in rapidly popularizing floor heating technique at present, such as heat emission from the panel, heat load of the room, the optimum thickness of the filling layer, common heat source with radiator systems, finishing layer matching with floor heating systems and configuration of insulation material bearing pressure. Puts forward several methods and suggestions accordingly. Also analyses the issue of energy saving of the floor heating system.

关 键 词：低温 热水供暖 地板供暖 负荷计算 节能 

分 类 号：TU832[建筑科学—供热、供燃气、通风及空调工程]