聚氧硫杂蒽树脂固化特性及其动力学的研究  

CURING BEHAVIOR AND KINETIC ANALYSIS OF NOVEL POLY(PHENOTHIOXINE-FORMALDELYDE) RESIN

作　　者：刘晓玲[1] 程彩霞[1] 盛寿日[1] 宋才生[1] 

机构地区：[1]江西师范大学化学和生物科学学院,南昌330027

出　　处：《高分子学报》2002年第3期297-300,共4页Acta Polymerica Sinica

基　　金：江西省科委重点攻关项目 (项目号 0 0 110 3 )

摘　　要：以DSC、TG等技术手段研究了聚氧硫杂蒽树脂 (POSPF)的固化特性及其动力学 .结果表明 ,用六次甲基四胺 间二氯苄作固化剂 ,加热至 10 5～ 2 2 5℃能使POSPF树脂固化 ,在固化过程树脂中的活性羟甲基和固化剂参与反应生成亚甲基桥从而形成网状体型结构 ;动态DSC曲线上出现宽的固化放热峰 ,用T β外推法确定其凝胶温度Ti=10 0 0℃、固化温度Tp=181 5℃、后固化温度Tf=2 2 5 7℃ .固化后树脂具有优良的耐热性 ,失重 5 %时热分解温度高达 4 0 3℃ .Curing behaviors and kinetic analysis of novel poly (phenothioxine-formaldehyde) (POSPF)resin were studied by means of IR, DSC and TG. It was shown that active hydroxymethyl groups changed into methylene in the curing process of resin by the use of hexamethylene-tetramine/alpha, alpha'-dichloro-m-xylene as curing agents. The exothermic peak on the DSC curve is wide and smooth because of lower activity of curing reaction. Initial temperature (T-i = 100degreesC), curing temperature (T-p = 181.5degreesC) and terminal temperature (T-f = 225.7degreesC) were calculated by extrapolating T-beta. The cured resin has good heat-resistance. The temperature of 5% thermal weight loss reach up to 403degreesC.

关 键 词：固化动力学 差示扫描量热法 热固性树脂 聚氧硫杂蒽树脂 固化特性 

分 类 号：TQ323[化学工程—合成树脂塑料工业]