Mo-Cu材料的性能和应用  

The Property and Application of Mo-Cu Composite

作　　者：牟科强[1] 邝用庚[1] 

机构地区：[1]钢铁研究总院,北京100081

出　　处：《金属功能材料》2002年第3期26-29,共4页Metallic Functional Materials

摘　　要：Mo Cu材料具有高的导热系数和较低的热膨胀系数及较好的耐热性能 ,因此有多方面的用途。其高的导热系数作为大功率电子器件和散热器件有较好的前途 ,其膨胀系数与 95 %瓷匹配可作为封接材料 ,其好的耐热性能可作为高温构件等等。本文介绍Mo Cu材料的物理、机械性能及制取工艺对材料性能的影响 ,主要介绍其膨胀系数、导热系数与材料组成的关系。另外 ,还涉及一些最新的研究和主要应用领域。Because of the high thermal conductivity,the lower coefficient of thermal expansion and higher temp resistance,the Mo Cu composite is applied in many fields, for example,heat sink material in high power semiconductor and other electronic device,sealing material to ceramics,constructional material for high temperature application,etc The mechanical properties,physical properties and fabricating method of Mo Cu composite are concluded The relationship of coefficient of thermal expansion and conductivity with the composition of Mo Cu are discussed In addition,some new research and application are referred to

关 键 词：Mo-Cu材料 物理机械性能 定膨胀合金 导热系数 

分 类 号：TG132.1[一般工业技术—材料科学与工程]