非金属材料化学镀工艺中基体表面活化方法的研究  

Research Development of Substrate Surface Activation Methods in Electroless Plating Process of Nonmetallic Materials

作　　者：刘建国[1] 陈存华[1] 郑家燊[1] 

机构地区：[1]华中科技大学化学系,湖北武汉430074

出　　处：《表面技术》2002年第3期5-8,共4页Surface Technology

摘　　要：简要介绍了非金属材料化学镀工艺中基体表面活化的几种方法 ,包括传统的基体表面活化法、气相沉积法、介电层放电法、光化学法、自催化活化法等。讨论了它们的原理、优缺点。In this paper, several substrate surface activation methods in electroless plating process of nonmetallic materials are briefly introduced, including conventional substrate surface activation, vapor deposition activation, DBD activation, photochemical activation and autocatalytic activation, etc. Their principles, advantages and disadvantages, the latest development and applied prospect are also discussed.

关 键 词：基体表面活化法 气相沉积法 DBD法 光化学活化法 自催化活化法 

分 类 号：TQ153.3[化学工程—电化学工业]