热镀55%Al-Zn时化合物层生长动力学研究  

Growth kinetics of intermetallic layer in 55% Al-Zn hot-dipping process with passivation method

作　　者：刘根凡[1] 李华飞[1] 郑家燊[2] 俞敦义[2] 

机构地区：[1]华中科技大学能源与动力工程学院 [2]华中科技大学化学系

出　　处：《华中科技大学学报（自然科学版）》2002年第7期7-10,共4页Journal of Huazhong University of Science and Technology(Natural Science Edition)

摘　　要：针对用钝化法在Q2 35钢板上热镀 5 5 %Al Zn ,进行了热镀时化合物层的生长动力学分析 ,建立了化合物层生长动力学数学模型并提出了其数学处理方法 .通过试验数据曲线拟合 ,获得了不同热镀温度下化合物层的生长动力学关系式及其反应扩散激活能 ,探讨了硅对化合物层形成和生长的影响 .Al Zn hot dipped cladding was prepared on carbon steel (Q235) sheet by passivation method. The growth kinetics of the intermetallic layer formed in 55?% Al Zn hot dipping bath was analyzed. A model of the growth kinetics and its calculation method were presented. Based on the experimental results, the growth relations of the intermetallic layer at different temperature and the activation energies of diffusion were obtained by curve fitting method, and the effect of silicon on the forming of intermetallic layer in the bath was also discussed.

关 键 词：55%Al-Zn 热镀 化合物层 数学模型 生长动力学 铝锌合金 反应扩散激活能 钝化法 

分 类 号：TG174.443[金属学及工艺—金属表面处理]