软接触结晶器内电磁场分布的数值模拟研究  

Numerical Simulation of the Distribution of Magnetic Field in the Soft Contacted Mold

作　　者：曲方懿[1] 郑贤淑[1] 周永东[1] 金俊泽[1] 

机构地区：[1]大连理工大学铸造工程研究中心,辽宁大连116023

出　　处：《铸造》2002年第7期420-424,共5页Foundry

基　　金：国家自然科学重大基金资助项目 (59995442 );博士点基金资助项目 (2 0 0 0 0 1 4 1 1 7)

摘　　要：采用互感耦合模型计算了软接触结晶器内的电磁场分布 ,讨论了结晶器开缝数、电源频率、功率以及感应线圈与结晶器相对位置对磁场分布的影响。结果表明 :增加开缝数提高了结晶器透磁性 ,增大了磁感应强度 ;磁感应强度随电源频率的增加而减小 ,随功率的增加而增大 ;磁感应强度的最大值在轴线上随感应线圈位置上升而增大且位置上移 ,在结晶器附近随感应线圈与结晶器之间的横向距离增大而减小。计算结果与试验结果〔1〕基本吻合 。A mutual inductance coupling model was used to calculate and simulate the distribution of magnetic field in the soft contacted mold. The effects of the number of split and some parameters,such as the power and frequency of electric source, the relative position between coil and mold, on the distribution of magnetic field were discussed. The results showed that the magnetic penetration and magnetic flux density were enhanced by increasing the number of split; the magnetic induction strength was increased with lowering frequency and with rising of power, on the axes, the maximum value of the magnetic induction strength was increased and its position rose up with the coil moving up, and near the coil, it was decreased when the distance between coil and mold becomes longer. The simulation results are consonant with the experiment results, so the model can be used to simulate the distribution of magnetic field in the soft contacted mold.

关 键 词：电磁连铸 数值模拟 电磁场 软接结晶器 

分 类 号：TG249.7[金属学及工艺—铸造]