印制电子用阻焊油墨及其发展趋势  

Solder Resist Ink for Printed Electronics and Its Developmental Tendency

作　　者：杨超[1] 常煜[1] 杨振国[1] 

机构地区：[1]复旦大学材料科学系,上海200433

出　　处：《影像科学与光化学》2014年第4期314-320,共7页Imaging Science and Photochemistry

摘　　要：本文介绍了PCB制造过程中所用阻焊油墨的研究现状及其发展趋势,重点介绍了可喷墨打印阻焊油墨、柔性电路板用阻焊油墨、水溶性碱显影感光阻焊油墨和LED封装用白色阻焊油墨的研究现状及趋势。Recent studies on solder resist ink for PCB manufacture and its developmental trend were introduced and reviewed, focusing on solder resist ink for inkier printing, solder resist for flexible electronics, water soluble photoimageable solder resist ink and white solder resist for LED package.

关 键 词：阻焊油墨 超支化树脂 喷墨打印 感光显影 

分 类 号：TN41[电子电信—微电子学与固体电子学]