电子设备模块与机箱导轨接触热阻测量  

Test of Contact Thermal Resistance between the Electronic Device Module and the Chassis Guide Rail

作　　者：白振岳[1] 杨明明[1] 郭建平[1] 

机构地区：[1]中航工业西安航空计算技术研究所,西安710068

出　　处：《机械工程师》2014年第7期58-59,共2页Mechanical Engineer

摘　　要：通过对电子设备模块内芯片的传热路径分析,建立了模块结构件与机箱导轨接触热阻测试系统,测量并计算出模块结构件与机箱导轨之间的接触热阻,并且得出在工程实际中6061铝合金固体—固体界面间接触热阻与模块功耗的关系,为后续设计计算、仿真提供了依据。The lest system of the contact thermal resistance between the model of electronic device anti the guide rail of chassis was established by analyzing the Ilea! transfer load of the electronic model chip. The contact thermal resistam＇e between the model of electronic devi（＇e and the guide rail of chassis was obtained bv test and ealculalion. The relationbetween the contact resistances of aluminunm 6061 solid-solid interface and the module power dissipalion was given for the future design and simulation.

关 键 词：接触热阻 6061铝合金 测试 

分 类 号：O482.22[理学—固体物理]