电镀锡板工艺发展概况及展望  

Development Overview and Prospects of Manufacture Process of Tin-Plating

作　　者：薄炜 

机构地区：[1]上海梅山钢铁股份有限公司,江苏南京210039

出　　处：《电镀与精饰》2014年第7期25-29,共5页Plating & Finishing

摘　　要：简要介绍了镀锡板生产的历史沿革,全面的阐述了现有各类电镀锡工艺的镀液组成及特点。从电镀锡工艺以及电镀锡机组生产工艺流程两方面论述了电镀锡技术中电镀液组分、添加剂和阳极对镀锡板制造的影响。并对未来的发展趋势进行了展望。In this paper, history of tin-plate manufacturing was briefly introduced. Electrolyte composition and characteristics of various tin-plating techniques were comprehensively expatiated. Effects of electrolyte composition, additives and anode on the tin-plate manufacturing were discussed from two aspects, including tin-plating techniques and tin-plating set production process. Development trend of tin plating was also prospected.

关 键 词：电镀锡 镀锡板 镀液组成 钝化 

分 类 号：TQ153.13[化学工程—电化学工业]