X射线荧光光谱法测定电镀锡板镀层中铅含量  

Determination of lead in electrolytic tinplate coating by X-ray fluorescence spectrometry

作　　者：黄港明 范纯 田慧玲 王君祥 

机构地区：[1]宝钢股份有限公司制造管理部,上海宝山201900 [2]宝钢工业技术服务有限公司检化验事业部,上海宝山201900

出　　处：《冶金分析》2014年第6期11-15,共5页Metallurgical Analysis

摘　　要：选取具有代表性的不同镀层质量及不同铅含量的电镀锡板样品为校准样品,采用欧盟BS EN 10333-2005（包装用钢与人和动物用食品、产品和饮料接触的扁平钢制品镀锡钢）标准要求的方法测定校准样品中镀锡层铅含量,解决了电镀锡板校准样品短缺的问题,并依此建立了X射线荧光光谱法直接测定电镀锡板样品中单位镀锡层质量中铅含量的分析方法.利用仪器自带的薄膜分析软件将样品分为两层（基板层和镀锡层）来逐层分析,校正了基板中铅造成的测量干扰.采用仪器自带的基本参数法（FP）软件,自动校正了单位镀锡层质量不同造成的锡元素干扰,使校准曲线的相关系数达到0.993.结果表明,方法适用于单位镀锡层质量为2.0 g/m2及以上,基板厚度大于0.2 mm样品的测定.采用方法对电镀锡板实际样品进行分析,测定结果与欧盟BS EN 10333标准方法吻合,相对标准偏差（n=6）在4％～20％之间.By selecting representative electrolytic tinplate samples with different coating mass and different lead content as calibration sample and adopting method regulated by European Union BS EN 10333 2005 （Steel for packaging the flat steel products in contact with human and animal food,products and beverages tinned steel） to determine the lead content in its tin coating,the shortage problem of electrolytic tinplate certified reference materials was solved.Thus,a method for direct determination of lead content in unit tin coating of electrolytic tinplate samples was established by X-ray fluorescence spectrometry.The samples were divided into two layers （substrate layer and tin coating） with film analysis software equipped in the instrument to correct the interference caused by lead in the substrate layer.Fundamental Parameters Method （FP） software equipped in the instrument was used to correct tin interference caused by different unit tin coating mass,so as to the correlation coefficient of the calibration curve reach 0.993.The result indicated the method was suitable for sample with unit tin coating mass more than 2.0 g/m2 and substrate thickness more than 0.2 mm.The proposed method was applied to the determination of actual electrolytic tinplate samples.The results were consistent with those obtained by European Union BSEN 10333 standard method,and the relative standard deviations （n =6） were 4％-20％.

关 键 词：镀锡板 镀层 铅 基本参数法 薄膜分析软件 锡 

分 类 号：O657.34[理学—分析化学]