Cu-Fe_(64)Ni_(36)合金显微组织及热膨胀性能研究  

Investigation on the Microstructures and Thermal Expansion Characteristics of Cu-Fe_(64)Ni_(36) Alloys

作　　者：刘兴军[1] 何洲峰[1] 施展[1] 杨水源[1] 王翠萍[1] 

机构地区：[1]厦门大学材料学院,福建厦门361005

出　　处：《厦门大学学报（自然科学版）》2014年第4期538-543,共6页Journal of Xiamen University：Natural Science

基　　金：国家自然科学基金重点项目(51031003);教育部博士学科点专项科研基金(20120121130004)

摘　　要：基于Cu-Fe-Ni三元系的计算相图设计制备了不同Cu质量分数的Cu-Fe64Ni36三元合金.通过电子探针仪、光学显微镜和热机械分析仪研究了淬火温度(1 000,1 100℃)及时效温度(600,700,800℃)对合金的微观组织和热膨胀性能的影响.研究结果表明:Cux(Fe0.64Ni0.36)100-x(x%,(100-x)%均为质量分数)合金在1 000℃保温24h淬火并在600℃时效100h后,其热膨胀系数明显减小.其中,Cu30(Fe0.64Ni0.36)70合金热膨胀系数为6.26×10-6℃-1,可以与电子封装中半导体材料的热膨胀系数相匹配.Based on the present calculated Cu-Fe-Ni ternary phase diagram, several Cu-Fe64 Ni36 ternary alloys with different copper contents were designed and prepared.In this study,the influence of quenching temperature （1 000,1 100℃ ） and aging temperature （600,700,800 ℃ ） on microstructures and thermal expansion coefficients （CTE） of the prepared alloys were investigated by electron probe micro-analysis,optical microscopy, and thermomechanical analyzer.The result shows that the CTE of the alloys after quenching at 1 000℃ and aging at 600 ℃ decrease obviously.Particularly, the Cu30 （Fe0. 64 Ni0.36 ） 70 （30 %, 70 %, by mass） alloy after heat treat- ment has a low CTE of 6.26 ×10^-6℃^-1,which can well match with that of semiconductor in electronic packaging.

关 键 词：Cu—Fe—Ni 相图 显微组织 热膨胀系数 

分 类 号：TG132.1[一般工业技术—材料科学与工程]