基于过程方法的硬件产品结构缺陷影响因素分析  

An Analysis of Influential Factors on Hardware Product Structure Defects Based on the Process Method

作　　者：刘卫东[1] 胡伟立[1] 郑慧萌[1] 肖承地[1] 

机构地区：[1]南昌大学机电工程学院,南昌330031

出　　处：《组合机床与自动化加工技术》2014年第7期34-37,共4页Modular Machine Tool & Automatic Manufacturing Technique

基　　金：国家自然科学基金资助项目(71161018)

摘　　要：为了减少产品在设计过程中因影响因素的考虑不足而导致的结构缺陷,基于过程方法分析了影响结构缺陷各个设计活动模块的影响因素,并且建立了产品结构缺陷的影响因素关系模型。在此基础上,利用模糊层次分析法对结构缺陷设计活动与影响因素定量化描述。研究成果对企业预防和控制硬件产品结构缺陷起到重要指导意义。In order to reduce the structure dftects which caused by insufficient consideration during the design process,this paper establish a relationship model on product structure defects based on the process method,which is applied to analyze the influential factors on each design activity module.On this basis,the fuzzy-AHP was applied to provide a quantitative description on the relationship between the structure defects design and their affective factors.The research result presents great references to develop measurements on prevention and control of hardware structure defects in the future.

关 键 词：结构缺陷 影响因素 关系模型 过程方法 

分 类 号：TH165.3[机械工程—机械制造及自动化] TG65[金属学及工艺—金属切削加工及机床]