非制冷热释电红外焦平面阵列读出电路的新型结构(英文)  

A Novel Structure of ROIC for Pyroelectric Uncooled IRFPA

作　　者：王冠男[1] 鲁文高[1] 周娟娟[1,2] 张雅聪[1] 陈中建[1] 吉利久[1] 

机构地区：[1]北京大学微纳电子系微米/纳米加工技术国家重点实验室,北京100871 [2]北京大学深圳研究生院信息工程学院,深圳518055

出　　处：《北京大学学报（自然科学版）》2014年第4期724-728,共5页Acta Scientiarum Naturalium Universitatis Pekinensis

摘　　要：提出一种带有列共用结构的电容跨阻放大器(CTIA)读出结构,以实现高线性度、低功耗、低噪声和较大输出范围。该结构可以降低像素结构的复杂性,提高电路设计的灵活度。电路采用奇偶行交替连续读出的方式。采用0.35μm DPTM工艺,利用该结构设计一个原型芯片。电源电压为5 V,每列CTIA结构功耗约为29.3μW,线性度为99.98%。该原型芯片可以被扩展为320×240阵列。The authors present a capacitive-transimpedance-amplifier （CTIA） structure which has a column-shared part for pyroelectric uncooled IRFPA （infrared focal plane array） to achieve high linearity, relatively low power, low noise and wide output range. This structure decreases the complexity of pixel circuit and obtains more design flexibility. To get continuous output, odd-even line alternate readout is adopted. A prototype chip using this architecture is designed with 0.35 μm DPTM process. The power supply is 5 V, power consumption of CTIA in each column is about 29.3 IxW and linearity is 99.98%. The prototype could be extended to 320×240 array.

关 键 词：热释电 读出电路 红外焦平面阵列 CTIA 

分 类 号：TN215[电子电信—物理电子学]