Thermal shock resistance behavior of a functionally graded ceramic: Effects of finite cooling rate  

作　　者：Zhihe Jin Yuezhong Feng 

机构地区：[1]Department of Mechanical Engineering, University of Maine,Orono, ME 04469, USA [2]School of Mechanical Engineering, Purdue University,West Lafayette, IN 47907, USA

出　　处：《Theoretical & Applied Mechanics Letters》2014年第4期42-46,共5页力学快报（英文版）

摘　　要：This work presents a semi-analytical model to explore the effects of cooling rate on the thermal shock resistance behavior of a functionally graded ceramic （FGC） plate with a periodic array of edge cracks. The FGC is assumed to be a thermally heterogeneous material with constant elastic modulus and Poisson＇s ratio. The cooling rate applied at the FGC surface is modeled using a linear ramp function. An integral equation method and a closed form asymptotic temperature solution are employed to compute the thermal stress intensity factor （TSIF）. The thermal shock residual strength and critical thermal shock of the FGC plate are obtained using the SIF criterion. Thermal shock simulations for an Al2O/Si3N4 FGC indicate that a finite cooling rate leads to a significantly higher critical thermal shock than that under the sudden cooling condition. The residual strength, however, is relatively insensitive to the cooling rate.This work presents a semi-analytical model to explore the effects of cooling rate on the thermal shock resistance behavior of a functionally graded ceramic （FGC） plate with a periodic array of edge cracks. The FGC is assumed to be a thermally heterogeneous material with constant elastic modulus and Poisson＇s ratio. The cooling rate applied at the FGC surface is modeled using a linear ramp function. An integral equation method and a closed form asymptotic temperature solution are employed to compute the thermal stress intensity factor （TSIF）. The thermal shock residual strength and critical thermal shock of the FGC plate are obtained using the SIF criterion. Thermal shock simulations for an Al2O/Si3N4 FGC indicate that a finite cooling rate leads to a significantly higher critical thermal shock than that under the sudden cooling condition. The residual strength, however, is relatively insensitive to the cooling rate.

关 键 词：CRACK functionally graded material heat transfer residual strength thermal shock 

分 类 号：O341[理学—固体力学]