Ni含量对(BiSbSn)xNi钎料电阻率及抗拉强度的影响  

Impact of the content of Ni on resistivity and tensile strength of (BiSbSn)xNi solder

作　　者：许媛媛[1] 闫焉服[1] 冯丽芳[1] 马士涛[1] 

机构地区：[1]河南科技大学材料科学与工程学院,河南洛阳471000

出　　处：《焊接技术》2014年第7期5-7,4,共3页Welding Technology

基　　金：国家自然科学基金资助项目(51175151)

摘　　要：研制开发高温无铅软钎料一直是钎焊领域中的一大难题,熔点为270℃左右的Bi5Sb8Sn钎料的电阻率及抗拉强度有时因达不到要求而使其应用受限。本文通过在Bi5Sb8Sn钎料中添加不同含量Ni形成新型(BiSbSn)xNi四元合金,以改善Bi5Sb8Sn合金的电阻率和抗拉强度。结果表明:尽管随着Ni含量的提高,(BiSbSn)xNi钎料合金的性能下降,但当w(Ni)2%时,钎料合金的电阻率最小,为2.13×10-6Ω·m;当w(Ni)1%时,钎料的抗拉强度最高,为44.26 MPa,相对基体提高了将近10%。Development of the high temperature lead-free soft solder is always a big problem in the brazing areas. Bi5Sb8 Sn solder with the melting point of around 270 t will be restricted because its resistivity and tensile strength can not meet the requirements. In the paper, a new solder was made by adding the content of Ni into（BiShSn）i：Ni alloy to improve the performance through alloying principle. The results showed that（ BiSbSn）.tNi solder alloy performances decreased with the inrreasement of Ni content. But when the Ni content was 2%,the resistivity of solder alloy was the lowest. It was 2.13xl0-6Ω·m. When the Ni content was 1%, the tensile strength of solder was 44.26 MPa, which was the largest and increased by nearly 10% compared to the matrix.

关 键 词：(BiSbSn)xNi钎料合金 Ni含量 电阻率 抗拉强度 

分 类 号：TG425.1[金属学及工艺—焊接]