电沉积CuS镀液的电化学性能及镀膜相组成  

Electrochemical Performance of CuS Plating Solution and Phases of Its Thin Film

作　　者：石璐丹[1] 刘科高[1] 张力[1] 高稳成 

机构地区：[1]山东建筑大学材料科学与工程学院,济南250101

出　　处：《表面技术》2014年第4期92-96,共5页Surface Technology

基　　金：国家自然科学基金(51272140);山东省高校科技计划资助项目(J11LD10)~~

摘　　要：目的获得结晶好、连续均匀的CuS薄膜。方法采用电沉积方法制备CuS薄膜,研究络合剂、硫源及铜硫离子比例对镀液电化学性能的影响,分析不同沉积电位下所得薄膜的相组成。结果柠檬酸钠的络合效果最好,EDTA最差;硫代硫酸钠作为硫源时,其还原电位较硫脲为硫源时正,氧化电位较负,水平距离值较小,更容易实现共沉积;铜硫离子比例为1时,施镀最合适。沉积电位为-0.8 V时,薄膜的XRD图谱中有氧化亚铜的衍射峰;当沉积电位在-0.9 V时,生成了Cu2S相;沉积电位在-0.9^-1.2V时,生成了目标产物CuS,并且-1.2 V时的衍射峰强度比较高,结晶良好。结论最佳沉积条件如下:柠檬酸钠为络合剂,硫代硫酸钠为硫源,铜硫离子比为1,沉积电位为-1.2 V。Objective To get good crystallization and continuous uniform CuS thin film. Methods The Cus thin film was prepared by the method of electrodeposition, so as to investigate the effect of complexing agent, sulfur sources and copper sulfion ion proportion on electrochemical properties of the plating solution, and analyze the phase composition of thin film in different deposition potential. Results The experimental results showed that sodium citrate was the best complexing agent, while EDTA was the worst. When choosing sodium thiosulfate as the source of sulfur, its reduction potential compared with thiourea would be more positive, oxidation potential would be more negative and the horizontal distance would have smaller values, which was easier to implement codeposition. The ratio of copper sulfide ion to 1 was the most suitable plating condition. When the deposition potential at-0. 8 V, the XRD atlas of thin film appeared the diffraction peaks of cuprous oxide; when the deposition potential at -0. 9 V, Cu2 S phase generated; when the deposition potential at -0. 9 ~ -1. 2 V, the target products CuS was produced, and the diffraction peaks intensity were higher. Conclusion The best depositional conditions are as following： sodium citrate as complexing agent, sodium thiosulfate as a source of sulfur, the ratio of copper and sulfur ion to 1, deposition potential at -1. 2 V.

关 键 词：电沉积 CUS 薄膜 镀液性能 

分 类 号：TQ153.3[化学工程—电化学工业]