Sn3.8Ag0.7Cu焊料与Fe-Ni镀层的液固界面反应  

Liquid-solid interfacial reaction between Sn3.8Ag0.7Cu solder and electrodeposited Fe-Ni alloys

作　　者：刘葳[1] 金鹏[1] 

机构地区：[1]北京大学深圳研究生院环境与能源学院,广东深圳518055

出　　处：《电子元件与材料》2014年第8期53-55,共3页Electronic Components And Materials

基　　金：国家自然科学基金青年基金资助项目(No.51301003)

摘　　要：在流动的还原性气氛中,研究了共晶Sn3.8Ag0.7Cu焊料与不同Fe含量的Fe-Ni合金层的液固界面反应行为。结果表明:低Fe含量的Fe-83Ni镀层与共晶Sn3.8Ag0.7Cu焊料具有较快的液固界面反应速率,高Fe含量的Fe-53Ni镀层与共晶Sn3.8Ag0.7Cu焊料具有较慢的液固界面反应速率,在界面处可以观察到致密的FeSn2白色化合物层。而Fe-74Ni镀层与共晶Sn3.8Ag0.7Cu焊料的液固界面反应速率介于二者之间。当共晶Sn3.8Ag0.7Cu焊料与Fe-Ni镀层反应时,界面处生成的致密的FeSn2白色化合物,可以有效地阻止Fe-Ni镀层的快速消耗。Liquid-solid interfacial reaction of eutectic Sn3.8Ag0.7Cu solder on electrodeposited Fe-Ni layers with different Fe contents was investigated in a vacuum furnace with H2 protection. The results show low-Fe Fe-83Ni layers are consumed faster by the liquid Sn3.8Ag0.7Cu, however, high-Fe Fe-53Ni layers have a lower consumption rate with dense FeSn2 compounds formed at the interface. The consumption rate of Fe-74Ni layer is between Fe-53Ni and Fe-83Ni. When Sn3.8Ag0.7Cu solder is reflowed on electrodeposited Fe-Ni layers, the formation of denser FeSn2 compounds at the interface can inhibit further interfacial reactions.

关 键 词：Sn3 8Ag0 7Cu Fe Ni镀层 界面反应 微观组织 UBM合金层 金属间化合物 

分 类 号：TG454[金属学及工艺—焊接]